n Light Weight. For footnotes refer to the last page. IRHM REF: MIL-PRF- / TOAA. This datasheet has been downloaded. 2N 2NU. JANSR (K RAD(Si)). JANSF (K RAD(Si)). ABSOLUTE MAXIMUM RATINGS (TC = +25°C unless otherwise noted). Parameters / Test. 2N datasheet, 2N pdf, 2N data sheet, datasheet, data sheet, pdf, Microsemi, N-Channel.
|Published (Last):||7 April 2011|
|PDF File Size:||5.98 Mb|
|ePub File Size:||5.75 Mb|
|Price:||Free* [*Free Regsitration Required]|
Cores are available in all IEEE standard sizes and over 1, special sizes. Thickness shall be 7.
Search the history of over billion web pages on the Internet. Where large sizes are required, it is possible to assemble them from two or more smaller machined or pressed sections; the variety of sizes and shapes is Hmidess.
2ninfo: Semiconductors, Stock Items
Where space is critical, the low profile CLP component should be considered, but at the expense of some reduction in electrical Q. C, C Types A, ft. If the PIN is not available with datasbeet A Lead finish, the same UN will be acquired except with the I or c l sad finish dssipteto’ si dttgrefned by 2n77269.
Drawing number PD defines the material properties of the wire in the following paragraph, 3. The type will be defined on the specif lcet Ion sheet. Inspection of die mounting d Inspection for foreign or extraneous material 3 4.
Mil- M datasbeet the controlling document for device class M, B and S. Detailed finish requirements for each of the electrical parts. Pure tin may not be used to coat any surface see H 4.
For glass- to -metal sealed products, all devices with terminals which are solder dipped to the seal shall pass screen 7 of table IV. This note prohibits the use of pure unalloyed tin finish on all surfaces. The manufacturer may have a pure tin finish plating that is used on some product. Silver-coated coppe r wire. Lead freiaa or terminal Material end finish ahet. Following these tests, the manufacturer shall submit adtasheet lot to the group A solderability test as specified in 4.
The device claee ahell be detipwtad by a single latter idwitifying tha quality 3. Thickness shall be 50 1.
The nickel plating shall be nonbrightened and low stress. S3j Aao Jtfaotj gNovifc-1 Preparing activity: The type of insulation consists of a two digit codes The type will be defined on the specificationsheet. AD core sizes ran be provided in non- metallic phenolic or plasticaluminum, or CVB Guaranteed Voltage Breakdown coated aluminum boxes. The specification fatasheet not prohibit the use of a pure tin finish.
No detects are allowed 12 i Ten of the 30 samples are then subjected to the sofcterabdity datawheet No tetocts are altoweo. The data sheet does not specify the material finish of the package or the leads.
Mniah letter Leac frwaa datasheeg tensing! The following DPA report,identifies the package as gold plated. The inductors are open coil E. Use of tin-lead finishes are acceptable provided that the minimum lead content is 3 percent. Dle ana tons Is inches unlees atherwlae specified. Ref- ” 1 Tin plated finishes.
IRHN7250 MOSFET. Datasheet pdf. Equivalent
I SEM anomalies if applicable. C – Copper oxygen free: Silver-coated copp er-cl a d steel wire.
The part leads can be identified as gold from the DPA color photographs. Lead is supplied with no external finish.
Component List  page :: Oxygen Electronics, LLC
Use of tin-lead Sn-Pb finishes are acceptable provided that the minimum lead content is 3 percent. The stan- ce rd profile 5P offers a compromise of electrical Q and mechanical size, and should be considered the component of choice for most applications.
Without sacrificing magnetic properties, many operations can be performed on ferrites, while maintaining strict dimensional or mechanical tolerances: