IN5821 DATASHEET PDF

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Self protection features include a two stage frequency reducing current limit for the output switch and an over temperature shutdown for complete protection under fault conditions. The size of the heatsink depends on the input voltage, the output voltage, the load current and the ambient temperature. Requiring a minimum number of external components, these regulators are simple to use and include internal frequency compensation, and a fixed-frequency oscillator.

Pulling this pin below a threshold voltage of approximately 1.

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Higher ambient temperatures require more heat sinking. Once exception to this is the output switch pin, which should not have large areas of copper. For the best thermal performance, wide copper traces and generous amounts of printed circuit board copper should be used in the board layout. The voltage spikes are present because of the fast switching action of the output switch, and the parasitic inductance of the output filter capacitor, To minimize these voltage spikes, special low inductance capacitors can be used, and their lead lengths must be kept short.

For best results, external components should be located as close to the switcher IC as possible using ground plane datasgeet or single point grounding. When using the adjustable version, special care must be taken as to the location of the feedback resistors and the associated wiring. If open core inductors are used, special care must be taken as to the location and positioning of this type daatsheet inductor.

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This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation is not implied.

This data was taken ddatasheet the circuit operating as a buck switching regulator with all components mounted on a PC board to simulate the junction temperature under actual operating conditions. The device is available in an adjustable or fixed output version. Typical Performance Characteristics Figure 4.

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The TD junction temperature rises above ambient temperature for a 3A load and different input and output voltages. An additional small LC filter dataasheet be added to the output as shown in Figure 14 to further reduce the amount of output ripple and transients.

A suitable input bypass capacitor must be present at this pin to minimize voltage transients and to supply the switching currents needed by the regulator. Feedback Senses the regulated output voltage to complete the feedback loop. Output Saturation Characteristics Figure 7.

Wiring inductance, stray datwsheet, as well as the scope probe used to evaluate these transients, all contribute to the amplitude of these spikes. This curve can be used for a quick check for the approximate junction temperature for various conditions, but be aware that there are many factors that can affect the junction temperature.

The TD Datasheeh package junction temperature rise above ambient temperature with a 3A load for various input and output voltages. Symbol Parameter Conditions Min. The PC board copper area that the package is soldered to should be at least 0.

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To minimize coupling to sensitive circuitry, the PC board copper area connected to this satasheet should be kept a minimum. It is capable of driving a 3A load with excellent line and load regulation. Additional copper area improves the thermal characteristicsbut with copper areas greater than approximately 6 in 2only small improvements in heat dissipation are realized.

The output ripple voltage is due mainly to the inductor sawtooth ripple current multiplied by the ESR of the output capacitor. Rapidly switching currents associated with wiring inductance can generate voltage transients which can cause problems.

Physically locate both resistors near the Datasjeet, and route the wiring away form the inductor especially an open core type of inductor. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

As in any dqtasheet regulator, layout is very important. Large areas of copper provide the best transfer of heat lower thermal resistance to the surrounding air, and moving air lowers the thermal resistance even further.

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Quiescent Current vs Temperature Figure 9. The copper and the board are the heat sink for this package and the other heat producing components, such as the catch diode and inductor.

Stresses greater than those listed under Maximum Ratings may cause permanent damage to the device. These temperature rise numbers are all approximate and there are many factors that can affect these temperatures. The TO surface mount package tab is designed to be soldered to the copper on a printed circuit board.