Gerold W. Neudeck and Robert F. Pierret, Editors. Volume V. Introduction to Microelectronic. Fabrication. Second Edition. Richard C. Jaeger. Auburn University. Microfabrication followed by Auburn. University. Wed, 12 Dec. GMT. lectr ation Fri, 14 Dec GMT introduction to microelectronic fabrication jaeger pdf. -. Microfabrication is the process of fabricating miniature structures of.

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This introductory book assumes minimal knowledge of the existence of integrated circuits and of the terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors. It presents to readers the basic information necessary for more advanced processing and design books. Focuses mainly on the basic processes used in fabrication, including lithography, oxidation, diffusion, ion implementation, and thin film deposition.

Covers interconnection technology, packaging, and yield. Appropriate for readers interested in the area of fabrication of solid state devices and integrated circuits. Jaeger, is a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing and is highlighted by careful explanations, clean, simple language, and numerous fully solved example problems.

The second edition includes an entirely new chapter on MEMS, as well as substantial modifications to the chapters on MOS and bipolar process integration. Also included is new or expanded coverage of lithography and exposure systems, trench isolation, chemical mechanical polishing, shallow junctions, transient enhanced diffusion, copper Damascene processes and process simulation. The spectacular advances in the development and application of integrated circuit IC technology have led to the emergence of microelectronics process engineering as an independent discipline.

Additionally, the pervasive use of integrated circuits requires a broad range of engineers in the electronics and allied industries to have a basic understanding of the behavior and limitations of ICs.

One of the goals of this book is to address the educational needs of individuals with a wide range of backgrounds. This text presents an introduction to the basic processes common to most IC technologies and provides a base for understanding more advanced processing and design courses.

In order to contain the scope of the material, we deal only with material related to silicon processing and packaging. Chapter 1 provides an overview of IC processes, and Chapters then focus on the basic steps used in fabrication, including lithography, oxidation, diffusion, ion implantation and thin film deposition, and etching. Interconnection technology, packaging, and yield are covered in Chapters 7 and 8. It is important to understand interactions between process design, device design, and device layout.

For this reason, Chapter 9 and 10 on MOS and bipolar process integration have been included. Major changes in the second edition of this text include new or expanded coverage of lithography and exposure systems, trench isolation, chemical mechanical polishing, shallow junctions, transient-enhanced diffusion, copper Damescene processes, and process simulation. The problem sets have been expanded, and additional information on measurement techniques has been included. The text evolved from notes originally developed for a course introducing seniors and beginning graduate students to the fabrication of solid-state devices and integrated circuits.


A basic knowledge of the material properties of silicon is needed, and we use Volume I of this Series as a companion text. An introductory knowledge of electronic components such as resistors, diodes, and MOS and bipolar transistors is also useful.

The material in the book is designed to be covered in one semester. In our case, the microelectronics fabrication course is accompanied by a corequisite laboratory.

EE 407 – Introduction to Microfabrication

The students design a simple device or circuit based upon their individual capability, and the designs are combined on a multiproject polysilicon gate NMOS chip. Design, fabrication, and testing are completed within the semester. Students from a variety of disciplines, including electrical, mechanical, chemical, and materials engineering; computer science; and physics, are routinely enrolled in the fabrication classes.

Before closing, I must recognize a number of other books that have influenced the preparation of this text. Howard, Integrated Circuit Engineering by A. Thanks also go to the many colleagues who have provided suggestions and encouragement for the new edition and especially to our laboratory manager Charles Ellis who has been instrumental in molding the laboratory sections of our course.

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Advanced Semiconductor Fundamentals 2nd Edition. Volume IV 2nd Edition. Modular Series on Solid State Devices: The Bipolar Junction Transistor 2nd Edition. Pearson; 2 edition October 27, Language: I’d like to read this book on Kindle Don’t have a Kindle? Share your thoughts with other customers.

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EE – Introduction to Microfabricatio – Todd J. Kaiser, Ph.D. | Montana State University

Read reviews that mention text reference fabrication semiconductor engineering. Showing of 21 reviews.

Top Reviews Most recent Top Reviews. There was a problem filtering reviews right now. Please try again later. A really helpful text. I cracked open this book not knowing a thing about MEMS and was able to follow the majority of the discussions. There are couple of practice problems in the text, but probably not enough microfavrication use it as sole preparation for an exam. This was mainly used as a reference text kaeger my Introduction to MEMS course, but it could give quite a lot of insight on its own.


Jweger of the methods are a little older, but many of them are still in practice. Kinda glosses over the important details but supplemented with good motes it makes for an easy read. Much shorter than Campbell. One person found this helpful. I bought this textbook for a graduate level mechanical engineering course.

introduction microelectronic fabrication jaeger solution

The material in there is solid. The explanations are not always self-evident i. I cannot understand all of the material without lecture to clarify the materialbut all of the information is there.

For a beginner in my Nano and Micro engineering classes this book is simple enough to read that I dont feel like i am completely lost in it. This book is for my current Chemical Engineering Semiconductor lab. It is very clear and concise which is nice.

I rather have a thin, well written book, than a dense and over-informative text. I would highly recommend it for after semiconductor fabrication coursework. This book offers a concise and pheripheral approach to introductory microelectric fabrication. It covers the essentials that are needed to delve into more intricate and complex fab issues. It is a good starting material for me, even though I might sometime get lost reading concepts from it only. It is great resource when you have it in company of another fab book.

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