JIS Z 3197 PDF

JIS Z Test methods for soldering fluxes (Foreign Standard). Available for Subscriptions. Content Provider Japanese Industrial Standards [JIS]. JIS Z Test methods for soldering fluxes (Foreign Standard. JIS Z Halide content(mass %). ~ JIS Z Copper plate corrosion test. Passed. JIS Z Insulation resistance test( Ω).

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Clear residue no-clean halide free flux used by assemblies’ manufacturer utilizing low solid no-clean wave soldering fluxes. Low-splash and halogen-free welding agent for tin wires and preparation method thereof.

Environment protection efficient water-based circuit board cleaning agent and preparation thereof.

RM-5 (Flux for BGA / CSP Solder Ball) | Nihon Superior Co., Ltd.

The said surface active agent is one or more of the nonion surface active agent, and the said organic amine and the derivant being ethanediamine, tetramethylenediamine, diethyl ethanolamine and so on, with the said film forming material being diethyl ethanolamine or resin.

Post flux residues can be washed with lukewarm water O C. Mis lead-free solder was washed with halogen-free flux, components of the flux by mass percentage: Brass and copper Brass and copper for consumer product. The nis can be completely removed with luke-warm simple water rinse.

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A soldering flux as claimed in claim 5, characterized in that: Flux for soldering electronic components on circuit substrates, and mounted or unmounted circuit substrate. Ideally used mainly by consumer products assemblies’. Aqua-soluble core flux was developed for used by assemblies’ manufacturer utilizing water-soluble wave soldering fluxes and aqua-soluble solder paste SME process The flux is thermally heat stable with minimal fumes and odor.

Aqua-soluble core flux for used by assembly’s manufacturer utilizing water washing cleaning process. More than 90 SnPb. Halogen-free lead-free soldering paste for jiss and preparation method thereof.

The said organic acid could be one or more of the aliphatic acid mono acid or bi-acid, aromatic acid, or amino acid.

The residues left are near neutral pH and the core-flux can be utilized with an open torch flame or a soldering iron. Fast and excellent instant wetting action used mainly 3179 consumer products assemblies manufacturer.

CN101062536A – Non-halide cleaning-free welding flux for leadless solder – Google Patents

Aqueous cleaning soldering flux for lead-free soldering and preparation method thereof. Brass and copper for consumer product.

Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof. A flux according to claim 1, wherein: The film-forming substance in the raw material, i.

Water 31977 soluble core flux.

Halogen-free soldering agent for tin bismuth system unleaded tin paste and preparation method thereof. Solder fillets can left up to 24 hours jus still remains shiny prior sending for post washing with water.

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CN CNA en.

CNA – Non-halide cleaning-free welding flux for leadless solder – Google Patents

The invention relates to a lead free soldering clean free soldering flux with the mass percentage of organic acid activating agent 1. The flux according to claim 1, wherein: CN CNA en More than 90 SnPb More than 80 Sn Halogen-free low-splash solder wire and preparation method of halogen-free low-splash solder wire. This flux is a high activity, heat stable with minimal fumes and odor. The soldering iis does not have halogen, being environmental protective, good in welding, welding spot being full and luminous, without residue, no corrosion, high in isolation resistance.

Colophony type non-halide cleaning-free soldering flux for lead-free solder wire. Clear residue core flux for lead-free alloy cored solder wire was developed for minimal spitting, fast and excellent instant wetting action, ideally suitable for critical products assemblies manufacturer requiring.

Preparation and use of the same method as in Example 1.